Chip Fabrication, ATMP Units, and OSAT Ecosystems

Chip fabrication, Assembly, Testing, Marking & Packaging (ATMP) units, and Outsourced Semiconductor Assembly and Test (OSAT) ecosystems form the core of the global semiconductor value chain, converting chip designs into functional electronic components.

In India, they are central to achieving strategic autonomy, supply-chain resilience, and strengthening digital infrastructure, defence preparedness, and industrial growth. The long-term vision focuses on an integrated ecosystem spanning fabrication, packaging, testing, and system-level integration, rather than isolated manufacturing.

Basic Concepts

  • Chip fabrication refers to the process of manufacturing integrated circuits on silicon wafers using nano-scale engineering techniques.
  • ATMP (Assembly, Testing, Marking, and Packaging) units perform post-fabrication processes that ....
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