India Lays Foundation for First Advanced 3D Chip Packaging Unit in Odisha
In April 2026, India laid the foundation stone for its first advanced 3D chip packaging unit in Bhubaneswar, marking a major step towards building a cutting-edge semiconductor ecosystem under the India Semiconductor Mission.
Background
- Foundation stone laid for India’s first advanced 3D chip packaging facility.
- Project located in Bhubaneswar, Odisha.
- Approved under the India Semiconductor Mission (ISM).
- Aims to position India at the global forefront of advanced semiconductor packaging technologies.
About the Project
- Investment: Rs.1,934 crore.
- Led by: US-based company 3D Glass Solutions.
- Backed by global players like:
- Intel
- Lockheed Martin
- Production capacity:
- ~70,000 glass panels annually.
- ~50 million assembled units.
- ~13,000 advanced 3D Heterogeneous Integration (3DHI) modules.
What is ....
Do You Want to Read More?
Subscribe Now
To get access to detailed content
Already a Member? Login here
Take Annual Subscription and get the following Advantage
The annual members of the Civil Services Chronicle can read the monthly content of the magazine as well as the Chronicle magazine archives.
Readers can study all the material since 2018 of the Civil Services Chronicle monthly issue in the form of Chronicle magazine archives.
Science & Technology
- 1 India Advances Defence Capabilities with Key Procurement Agreements
- 2 Indian Navy Commissions INS Taragiri Stealth Frigate
- 3 Digital Humans
- 4 IVRI Produces Indigenous Sahiwal Calves Using IVF Technology
- 5 Artemis II Mission Completes Historic Lunar Fly-by
- 6 India Demonstrates 1,000-km Quantum Communication Network
- 7 India’s Prototype Fast Breeder Reactor (PFBR) Achieves Criticality
- 8 Indian Navy Inducts ‘Dunagiri’ Stealth Frigate
- 9 Indian Navy Inducts ‘Sanshodhak’
- 10 ‘Malwan’ Anti-Submarine Warfare Shallow Water Craft
