- 1 Indian Army Releases First UAS & Loitering Munitions Roadmap
- 2 India Advances Defence Capabilities with Key Procurement Agreements
- 3 Indian Navy Commissions INS Taragiri Stealth Frigate
- 4 Indian Navy Inducts ‘Dunagiri’ Stealth Frigate
- 5 ‘Malwan’ Anti-Submarine Warfare Shallow Water Craft
- 6 Indian Navy Inducts ‘Sanshodhak’
- 7 India’s Prototype Fast Breeder Reactor (PFBR) Achieves Criticality
- 8 India Demonstrates 1,000-km Quantum Communication Network
- 9 IVRI Produces Indigenous Sahiwal Calves Using IVF Technology
- 10 Artemis II Mission Completes Historic Lunar Fly-by
- 11 Mission MITRA Launched to Study Human Factors for Space Missions
- 12 IOC Mandates SRY Gene Screening for Female Athletes
- 13 India Commissions Third SSBN ‘Aridhaman’
- 14 First NGOPV ‘Shachi’ Launched in Goa
- 15 Dengue Vaccine TAK-003 Cleared by DCGI
- 16 Keytruda
- 17 Memristor
- 18 Digital Humans
India Lays Foundation for First Advanced 3D Chip Packaging Unit in Odisha
In April 2026, India laid the foundation stone for its first advanced 3D chip packaging unit in Bhubaneswar, marking a major step towards building a cutting-edge semiconductor ecosystem under the India Semiconductor Mission.
Background
- Foundation stone laid for India’s first advanced 3D chip packaging facility.
- Project located in Bhubaneswar, Odisha.
- Approved under the India Semiconductor Mission (ISM).
- Aims to position India at the global forefront of advanced semiconductor packaging technologies.
About the Project
- Investment: Rs.1,934 crore.
- Led by: US-based company 3D Glass Solutions.
- Backed by global players like:
- Intel
- Lockheed Martin
- Production capacity:
- ~70,000 glass panels annually.
- ~50 million assembled units.
- ~13,000 advanced 3D Heterogeneous Integration (3DHI) modules.
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