India Lays Foundation for First Advanced 3D Chip Packaging Unit in Odisha
In April 2026, India laid the foundation stone for its first advanced 3D chip packaging unit in Bhubaneswar, marking a major step towards building a cutting-edge semiconductor ecosystem under the India Semiconductor Mission.
Background
- Foundation stone laid for India’s first advanced 3D chip packaging facility.
- Project located in Bhubaneswar, Odisha.
- Approved under the India Semiconductor Mission (ISM).
- Aims to position India at the global forefront of advanced semiconductor packaging technologies.
About the Project
- Investment: Rs.1,934 crore.
- Led by: US-based company 3D Glass Solutions.
- Backed by global players like:
- Intel
- Lockheed Martin
- Production capacity:
- ~70,000 glass panels annually.
- ~50 million assembled units.
- ~13,000 advanced 3D Heterogeneous Integration (3DHI) modules.
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